{"id":19725,"date":"2018-11-29T12:37:15","date_gmt":"2018-11-29T17:37:15","guid":{"rendered":"https:\/\/itp.nyu.edu\/opportunities\/?p=19725"},"modified":"2018-11-29T12:37:15","modified_gmt":"2018-11-29T17:37:15","slug":"intern-tomorrow-lab-internship","status":"publish","type":"post","link":"https:\/\/itp.nyu.edu\/opportunities\/2018\/11\/29\/intern-tomorrow-lab-internship\/","title":{"rendered":"INTERN: Tomorrow Lab Internship"},"content":{"rendered":"<h3 dir=\"ltr\">Tomorrow Lab Internship<\/h3>\n<p dir=\"ltr\"><strong>EE Internship Description<\/strong><\/p>\n<p dir=\"ltr\">Join our team of Electrical, Mechanical, and Industrial Design Engineers in creating exciting and revolutionary hardware products that range over a wide variety of industries. Interns gain hands-on, real-world experience working with our team on both client-facing and internally-lead projects. While the focus of this internship is on Electrical Engineering, you will get to explore and work with our other non-Electrical engineers in our office. Interns earn a stipend and are required to work 5 days per week onsite at our office.<\/p>\n<p dir=\"ltr\"><strong>Requirements<\/strong><\/p>\n<ul>\n<li dir=\"ltr\">\n<p dir=\"ltr\">BS or BE in Electrical Engineering, Computer Science with hardware focus, or related Electronic Design field of study<\/p>\n<\/li>\n<li dir=\"ltr\">\n<p dir=\"ltr\">Familiarity with digital circuit design &amp; embedded systems<\/p>\n<\/li>\n<li dir=\"ltr\">\n<p dir=\"ltr\">Experience in Schematic and Circuit layout in Eagle (or Altium\/KiCAD)<\/p>\n<\/li>\n<li dir=\"ltr\">\n<p dir=\"ltr\">Embedded software capability, such as C, C++, or Arduino<\/p>\n<\/li>\n<li dir=\"ltr\">\n<p dir=\"ltr\">Comfortable with or interested in prototyping processes on platforms like Arduino<\/p>\n<\/li>\n<li dir=\"ltr\">\n<p dir=\"ltr\">Strong Debugging skills &#8211; Able to identify problems and find solutions<\/p>\n<\/li>\n<li dir=\"ltr\">\n<p dir=\"ltr\">Experience with making things by hand<\/p>\n<\/li>\n<li dir=\"ltr\">\n<p dir=\"ltr\">Be a self-starter and able to work both independently and on teams<\/p>\n<\/li>\n<li dir=\"ltr\">\n<p dir=\"ltr\">Comfortable working on Mac and PC computers<\/p>\n<\/li>\n<\/ul>\n<p dir=\"ltr\"><strong>Nice To Have<\/strong><\/p>\n<ul>\n<li dir=\"ltr\">\n<p dir=\"ltr\">Familiarity with the Design and Manufacturing Process and engaging with creative teams<\/p>\n<\/li>\n<li dir=\"ltr\">\n<p dir=\"ltr\">Background in creative field including product design<\/p>\n<\/li>\n<li dir=\"ltr\">\n<p dir=\"ltr\">Experience developing a Bill of Materials and electronic component part sourcing<\/p>\n<\/li>\n<li dir=\"ltr\">\n<p dir=\"ltr\">Experience with RF and antenna design<\/p>\n<\/li>\n<li dir=\"ltr\">\n<p dir=\"ltr\">Familiarity with popular IDEs such as Eclipse or Segger<\/p>\n<\/li>\n<li dir=\"ltr\">\n<p dir=\"ltr\">Experience with Android\/iOS App development<\/p>\n<\/li>\n<li dir=\"ltr\">\n<p dir=\"ltr\">Experience with Fusion 360 or any 3D modeling<\/p>\n<\/li>\n<li dir=\"ltr\">\n<p dir=\"ltr\">Provide a portfolio outlining their work and interests<\/p>\n<\/li>\n<li dir=\"ltr\">\n<p dir=\"ltr\">Technical writing skills<\/p>\n<\/li>\n<\/ul>\n<p dir=\"ltr\">Non-US Citizens are welcome to apply and will need to lead their own US Visa application process.<\/p>\n<p dir=\"ltr\"><strong> See more and apply <a href=\"https:\/\/www.tomorrow-lab.com\/careers\">here<\/a>.<\/strong><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Tomorrow Lab Internship EE Internship Description Join our team of Electrical, Mechanical, and Industrial Design Engineers in creating exciting and revolutionary hardware products that range&#8230;<\/p>\n","protected":false},"author":122,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[7],"tags":[],"class_list":["post-19725","post","type-post","status-publish","format-standard","hentry","category-intern","entry"],"_links":{"self":[{"href":"https:\/\/itp.nyu.edu\/opportunities\/wp-json\/wp\/v2\/posts\/19725","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/itp.nyu.edu\/opportunities\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/itp.nyu.edu\/opportunities\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/itp.nyu.edu\/opportunities\/wp-json\/wp\/v2\/users\/122"}],"replies":[{"embeddable":true,"href":"https:\/\/itp.nyu.edu\/opportunities\/wp-json\/wp\/v2\/comments?post=19725"}],"version-history":[{"count":0,"href":"https:\/\/itp.nyu.edu\/opportunities\/wp-json\/wp\/v2\/posts\/19725\/revisions"}],"wp:attachment":[{"href":"https:\/\/itp.nyu.edu\/opportunities\/wp-json\/wp\/v2\/media?parent=19725"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/itp.nyu.edu\/opportunities\/wp-json\/wp\/v2\/categories?post=19725"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/itp.nyu.edu\/opportunities\/wp-json\/wp\/v2\/tags?post=19725"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}