Press "Enter" to skip to content


The Dieline Packaging Design Conference will be in Boston from June 22-25 and we’re expecting OVER 500 package designers PLUS an additional 2,500 design professionals!

Sign up by February 7 to get the EARLY BIRD SPECIAL which gives you the LOWEST RATES & AMAZING MARKETING! You’ll get our Dieline Bonus Package which includes the following items:

  1. One email blast to the Dieline Conference Attendee List
  2. BEST spot on the exhibit hall floor
  3. Ad on the Dieline Packaging Design Conference website from February 2012 to June 2012
  4. Ad on a Dieline Conference eNewsletter

The Dieline Packaging Design Conference is the single best way for you to get rare face-to-face time with an audience of 500+ packaging designers PLUS 2,500+ graphic designers from the HOW Conference. In fact, 35% of HOW Conference attendees do package design — that’s an additional 875 package design prospects for you!

And The Dieline Packaging Design Conference provides extra services to help you reach these customers before, during and after the event, from specialized emails and an enhanced website presence to product promotion and branding opportunities.

There’s no time to wait—make plans to join The Dieline Packaging Design Conference in Boston June 22-25 for HOW Design LIVE 2012.

For more information on sponsoring or exhibiting, contact Monet Stansbury at 513-305-1963 or